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Double Sided Polished Monocrystalline Silicon Wafers

Monocrystalline silicon wafers are usually packaged in air cushion film or foam material to protect their surface finish and integrity.

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Description

Monocrystalline silicon wafer has the characteristics of high purity, high crystal quality, low impurity content and good stability. Its surface flatness and photoelectric conversion efficiency are high, which can improve the conversion efficiency of solar cells. In the manufacture of integrated circuits, monocrystalline silicon can improve the performance and reliability of chips.

Specifications:
Monocrystalline silicon wafers are usually specified in terms of diameter and thickness. At present, the diameter of monocrystal silicon sheet can reach more than 300mm, and the thickness can reach tens to hundreds of microns. Different applications require different specifications of monocrystalline silicon wafers.

Specification

Crystalline structure	Monocrystalline	Notch angle	90°+5°/-1°
Growth Method	Cz	Notch orientation	<100>+-1°or <110>+-1°
Dislocation density(oms/cm*3)	Acceptable or None	Rolling	Yes or No
Conductance type	P/N	Length(mm)	>=100mm
Crystal orientation	111/100/110	MOQ(>=200kg)	380kg/furnace
Resistivity(Ω.cm)	0.001-1000	Diameter(mm)	Customer standard
Dopant	B/P/As/Sb	Oxygen concentration(ppma)
Crystal diameter range(mm)	100-360	Carbon concentration(ppma)
Surface metals(oms/cm*2)	<=5E10	RRG
Notch	SEMI Standard	ORG
Notch depth(mm)	1.0+0.25/-0.00	Lifetime(us)